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Toyota, Nissan, and Honda Join Forces on AI and Chip Development for Next-Gen Vehicles
Toyota, Nissan, and Honda have teamed up to develop cutting-edge AI and semiconductor technologies for next-generation vehicles, focusing on areas like semiconductor chips, APIs, virtual simulation, and cybersecurity. Supported by Japan's Ministry of Economy, Trade, and Industry, this collaboration aims to enhance Japan's competitiveness in the evolving automotive industry. The initiative includes forming the Advanced SoC Research for Automotive (ASRA) group, involving 12 companies, to create high-performance system-on-chip (SoC) technologies for mass production by 2030, marking a significant advancement in software-defined vehicles (SDVs) and autonomous driving capabilities
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12.23.2025
Michigan House Panel Removes $40M State Funding for Hemlock Semiconductor Expansion
Michigan lawmakers removed $40M tied to Hemlock Semiconductor’s expansion. Here’s what it means for CHIPS-linked supply chains and chip materials.
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12.23.2025
QuickLogic Expands DoD FPGA Program to $88M with Global Foundries
QuickLogic expanded a U.S. government Strategic Radiation Hardened (SRH) FPGA program, raising the contract ceiling to about $88M and adding GlobalFoundries’ 12LP process. The move supports DoD and space-system electronics where trusted supply and radiation resilience matter.
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12.23.2025
Korea Zinc Secured $210M CHIPS Act Funding to Supply Critical Minerals
Korea Zinc subsidiary Crucible Metals secured $210M in CHIPS Act funding to support a $6.6B Tennessee smelter and minerals processing project producing copper, gallium, germanium, indium and other inputs used in semiconductor supply chains.
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12.22.2025
Texas Instruments Starts Production at New Sherman 300mm Fab Expanding U.S. Supply for Industrial, Automotive, and Power Electronics
Texas Instruments has started production at its new SM1 300mm wafer fab in Sherman, Texas, strengthening U.S.-based capacity for high-volume “foundational” chips used across automotive, industrial, medical, and power electronics.
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12.22.2025
CHIPX Plans ASEAN’s First 8-Inch GaN/SiC Wafer Fab in Malaysia to Expand Power and Photonics Capacity
Ireland-based CHIPX says it will build an 8-inch (200mm) GaN/SiC wafer fabrication facility in Malaysia. The project aligns with Malaysia’s National Semiconductor Strategy and targets power and photonics devices for AI data centers, EV electrification, and aerospace systems.
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12.18.2025
Trump Challenges State-by-state Laws Pushing One National AI Policy
A new Trump executive order aims to replace a patchwork of state AI laws with one national framework, directing federal agencies to challenge conflicting rules and work with Congress on policy.
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12.18.2025
DNP’s 10nm Nanoimprint Template Signals a New Path Beyond EUV for Advanced Logic
Dai Nippon Printing says it achieved 10nm line-pattern resolution on a nanoimprint lithography template positioned to support 1.4nm-generation logic patterning with major energy-saving claims and a 2027 mass-production target.
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12.17.2025
Siemens and GlobalFoundries Targets AI-driven Fab Automation and Predictive Maintenance
Siemens and GlobalFoundries signed an MoU to deploy AI-enabled automation and predictive maintenance in fabs to boost efficiency, reliability, and security.
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12.17.2025
GE Vernova and Washington Move to Secure Yttrium Supply
GE Vernova says it’s working with the U.S. government to boost yttrium stockpiles as China’s export controls tighten supply and raise costs for energy, aerospace, and semiconductors.
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12.16.2025
SK On and Ford Ends BlueOval SK as They Pivots to Energy Storage Systems
Ford and SK On are ending the BlueOval SK joint venture and splitting plant ownership as battery capacity shifts toward battery energy storage systems amid softer EV demand. Here’s what it means for power electronics and sourcing.
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