Home Products Electromechanical Thermal Management Heat Sinks 7717-152NG

BOYD 7717-152NG

7717-152NG,BOYD LACONIA LLC,HEAT SINKS SEMICONDUCTOR PAD FOR TO-18 NYLON 5.08MM OUTER DIAMETER 1.14MM THICK

7717-152NG BY BOYD LACONIA LLC IS A SEMICONDUCTOR HEAT SINK PAD FOR TO-18 PACKAGES MADE OF NYLON WITH 5.08MM OUTER DIAMETER AND 1.14MM THICKNESS DESIGNED FOR EFFICIENT THERMAL MANAGEMENT.

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BOYD 7717-152NG

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