Micron Breaks Ground on $24B Singapore Fab as AI Pushes NAND Demand Higher

Micron Technology has officially broken ground on a new advanced wafer fabrication facility in Singapore, marking a planned US$24 billion investment over the next decade to expand its NAND manufacturing footprint and support long-term growth in data-centric and AI-driven applications.

The new facility will be constructed within Micron’s existing NAND manufacturing complex and is designed to deliver approximately 700,000 square feet of cleanroom space. Micron expects wafer production to begin in the second half of calendar 2028.

Once completed, the facility will be Singapore’s first double-storey wafer fabrication plant, reflecting the company’s focus on advanced manufacturing, automation, and efficient land use. Micron estimates the project will create around 1,600 new jobs, spanning engineering, manufacturing operations, and advanced automation roles. Combined with Micron’s previously announced HBM advanced packaging expansion in Singapore, the company expects its local workforce to grow by approximately 3,000 roles.

Strengthening Singapore’s Role in Micron’s Global Manufacturing Network

Micron said the investment reinforces Singapore’s position as a key manufacturing and innovation hub within its global production network, supporting both front-end wafer fabrication and back-end advanced packaging.

At the groundbreaking ceremony, Micron was joined by senior Singapore government officials, including Deputy Prime Minister and Minister for Trade and Industry Gan Kim Yong, MTI Permanent Secretary Beh Swan Gin, Economic Development Board Managing Director Jermaine Loy, and JTC CEO Jacqueline Poh, underscoring the strategic importance of the project to Singapore’s semiconductor ecosystem.

Micron Executive Vice President of Global Operations Manish Bhatia said the new facility will support the company’s long-term technology transitions while strengthening supply-chain resilience and ecosystem partnerships in the region.

The Singapore Economic Development Board described the fab as an anchor investment that will deepen advanced manufacturing capabilities and reinforce Singapore’s role as a critical node in the global semiconductor supply chain, particularly as AI workloads drive demand for advanced memory and storage technologies.

Part of a Broader Global Capacity Expansion

The Singapore fab forms part of Micron’s broader multi-year global expansion strategy:

• • In Singapore, Micron’s HBM advanced packaging facility is on track to begin contributing meaningfully to HBM supply in calendar 2027, supporting AI accelerator and high-performance computing demand.
  • In the United States, Micron has begun construction on a US$100 billion memory manufacturing complex in New York, with production expected to start around 2030.
  • In Taiwan, Micron has signed a letter of intent to acquire PSMC’s P5 site in Tongluo, adding approximately 300,000 square feet of 300-mm cleanroom space, with DRAM wafer output targeted for the second half of 2027.

Together, these projects reflect Micron’s strategy to balance front-end wafer capacity across NAND and DRAM with back-end advanced packaging, aligning investment timing with projected AI-driven demand growth.

Micron said the new Singapore facility will align with its sustainability and manufacturing excellence commitments. The company noted that its Singapore operations have been recognized as a World Economic Forum Sustainability Lighthouse and an Energy Efficiency National Partnership award recipient, with the new fab expected to incorporate energy-efficient systems, water recycling, abatement technologies, and waste-reduction practices consistent with LEED-related standards.